Solder pad for printed circuit boards



FIG. 1 is a front plan view of a solder pad for printed circuit boardsof the present invention;

FIG. 2 is a rear plan view thereof;

FIG. 3 is a left side elevational view of the solder pad, as viewed fromthe left side of the page. FIG. 3 is not drawn to scale, and thethickness is exaggerated in order to illustrate that the solder pad doeshave a measurable thickness to it;

FIG. 4 is a top side elevational view of the solder pad, as viewed fromthe top side of the page. FIG. 4 is not drawn to scale, and thethickness is exaggerated in order to illustrate that the solder pad doeshave a measurable thickness to it. The right side and bottom sideelevational views are not shown, since the symmetry of the solder padprovides a right and bottom view which is the same as the left and topview;

FIG. 5 is a front plan view of an alternative embodiment of a solder padfor printed circuit boards of the present invention;

FIG. 6 is a rear plan view thereof;

FIG. 7 is a left side elevational view of the alternative embodiment ofthe solder pad, as viewed from the left side of the page. FIG. 7 is notdrawn to scale, and the thickness is exaggerated in order to illustratethat the solder pad does have a measurable thickness to it; and,

FIG. 8 is a front side elevational view thereof. The right side and rearelevational views thereof are not shown, since the symmetry of thesolder pad provides right side and rear views which are the same as theleft side and front views.

The ornamental design for a solder pad for printed circuit boards, asshown and described.